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Home > products > Room Temperature Epoxy >
Room Temperature curing resin for electronics huntsman bulk epoxy resin cheap price

Room Temperature curing resin for electronics huntsman bulk epoxy resin cheap price

Electronics Huntsman Bulk Epoxy Resin

Room Temperature curing resin

Electronics huntsman bulk epoxy resin

Place of Origin:

China

Brand Name:

wenyou

Certification:

ISO9001, ISO14001, SGS, and UL

Model Number:

8116A

Contact Us
Request A Quote
Room Temperature curing resin for electronics huntsman bulk epoxy resin cheap price
Room Temperature curing resin for electronics huntsman bulk epoxy resin cheap price Room Temperature curing resin for electronics huntsman bulk epoxy resin cheap price Room Temperature curing resin for electronics huntsman bulk epoxy resin cheap price
Product Details
Classification:
Two-component Pre-mixed Epoxy Resin And Curing Agent
Usage:
Insulation Products, Connectors, Etc.
Application:
Various Products Cured At Room Temperature
Appearance Of Epoxy Resin:
Milky White Viscous Liquid
Appearance Of Hardener:
Yellow Viscous Liquid
Viscosity At 25°C:
8000 - 18000mPa.s
Density At 25°C:
1.55-1.70g/cm3
Vapor Pressure At 25°C:
＜ 0.01Pa
Flash Point:
Around 135°C
Description:
Room Temperature Curing Resin For Electronics Huntsman Bulk Epoxy Resin Cheap Price
Payment & Shipping Terms
Minimum Order Quantity
20kg/pail as sample
Price
Negotiable
Packaging Details
20kg/pail, 220kg/barrel, 1200kg/tank
Delivery Time
7 -10 work days
Payment Terms
Normally L/C, T/T
Supply Ability
Plenty of raw material in stock
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Contact Us
86-21-64308192
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Product Description

Brief Introduction

Room Temperature curing resin for electronics huntsman bulk epoxy resin cheap price

LW-8116A is an economical modified BPA (bisphenol A) epoxy resin that comes pre-mixed with fillers.

LH-8116 is a specially formulated modified amine hardener.

Applications

  • Suitable for a variety of products cured at room temperature, including insulation materials, connectors, and more.

Processing Methods

  • Automatic Pressure Gelation Process (APG)
  • Manual Injection

Properties

  • This system consists of a two-component epoxy resin and curing agent, maintained in a slurry state at room temperature for ease of application.

 

Formulation

 

Epoxy resin LE-8116A 100 pbw
Hardener LH-8116 8 -12 pbw
Filler Silica Powder 250 - 4350 pbw
Color paste LC series * 1 pbw

 

Package Image

 

Room Temperature curing resin for electronics huntsman bulk epoxy resin cheap price 0

 

Example application image

 

Room Temperature curing resin for electronics huntsman bulk epoxy resin cheap price 1

 

Tags：

Liquid Epoxy Resin Hardener

Electrical Apparatus Room Temperature Epoxy

high temp epoxy resin Light Yellow

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Tel：86-21-57500369-841
Email：hope.lu@sh-wysy.com
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Shanghai Wenyou Industry Co., Ltd.
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